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S1190
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S1190
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S1190

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Remarks:

1. Specification sheet: IPC-4101/126, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3. All the typical values  listed above are for your reference only and not intended for  specification. Please contact Shengyi Technology Co., Ltd. for detailed  information. All rights from this data sheet are reserved by Shengyi  Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the  duration of preconditioning in hours, the second digit the  preconditioning temperature in ℃ and the third digit the relative humidity.

ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.24.4DMA200
Tg
TMA
170
TdIPC-TM-650 2.4.24.65% wt. loss350
CTE (Z-axis) IPC-TM-650 2.4.24Before Tgppm/℃45
After Tgppm/℃210
50-260℃%2.3
T260IPC-TM-650 2.4.24.1TMAmin>60
T288IPC-TM-650 2.4.24.1TMAmin45
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip-->100s No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm2.51E+08
E-24/125MΩ.cm1.88E+06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance3.29E+07
E-24/1252.38E+06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s146
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV65
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91GHz--4.6
IPC-TM-650 2.5.5.9
1MHz--4.8
Dissipation Factor (Df)IPC-TM-650 2.5.5.91GHz--0.015
IPC-TM-650 2.5.5.9
1MHz--0.009
Peel Strength (1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.25
125℃N/mm
Flexural StrengthLWIPC-TM-650 2.4.4AMPa530
CWIPC-TM-650 2.4.4AMPa410
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.07
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0




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