Remarks:
*Certified to IPC-4204/11 Copper Clad Adhesiveless
Items | Method | Condition | Unit | Typical Value |
---|
Peel Strength (90°) | IPC-TM-650 2.4.9D | Accepted | N/mm | 0.9 |
288℃, 5s | 0.9 |
Solder Resistance | IPC-TM-650 2.4.13.F | 288℃, 10s | - | No delamination |
Dimensional Stability | IPC-TM-650 2.2.4B | After Etched
| % | -0.0391/-0.0499 |
Chemical Resistance | IPC-TM-650 2.3.2G | After Chemical Exposure | % | 97
|
Electric Strength | IPC-TM-650 2.5.6.2A | D-48/50+D-0.5/23 | KV/mm | 126 |
Volume Resistivity | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ-cm | 4.51×108
|
Surface Resistance | IPC-TM-650 2.5.17E | C-96/35/90 | MΩ
| 1.71×105
|
Dielectric Constant (10GHz) | SPDR | C-24/23/50 | - | 2.92 |
Dissipation Factor (10GHz) | SPDR | C-24/23/50
| - | 0.0032 |
Folding Endurance | JIS C-6471 | R0.38×4.9N
| Times | >1000 |
Flammability | UL94 | E-24/125 | Rating | V-0
|